Commercialization @ BEILab ±â¼úÀÀ¿ë @ ºñÀ̾ÆÀÌ·¦
Name | BEILab Study Series - ALD 2 inch |
---|---|
Main dimensions | 1000 x 660 x 1080 (L x W x H) |
Substrate heating | Top / bottom dual heat-up for thermal uniformity |
Substrate temperature range | RT ~ 330¡É |
Source temperature range | RT ~ 120¡É |
ALD type | Thermal ALD (flow-through type) |
Precursor | Multi-source supplies |
Delivery type | Injection of vaporized source with carrier gas |
Highly reliable valves | KITZ (JAPAN) |
Sample size | 2, 4, 6, 8 inch in diameter |
Loading wafer type | Silicon wafer, glass, etc |
Film uniformity | ¡Â5% (Al2O3 |
MFC flow rate (Ar, N2 |
0 ~ 500 sccm |
Chamber inner space height | ~8mm |
Foot print | 660 x 1000 mm |
Wafer loading | Open load |
Vacuum gauge | Capacitance manometer (up to 10 Torr) |
User interface | Desktop-window GUI |
Ultimate pressure (rotary pump) |
~ 10-3
|